Author(s): Yu-Ri Choi, Min-Kyung Kang

Email(s): kmk0709@hanseo.ac.kr

DOI: 10.5958/0974-360X.2018.00473.0   

Address: Yu-Ri Choi1, Min-Kyung Kang*2
1Department of Dental Hygiene, Hallym Polytechnic University, 48 Janghakgil, Dong-Myeon, Chuncheon-si, Gangwon-do,24210, Korea
2Department of Dental Hygiene, Hanseo University, 46 Hanseo 1-ro, Haemi-myun, Seosan-si, Chungcheongnam-do, 31963, Korea
*Corresponding Author

Published In:   Volume - 11,      Issue - 6,     Year - 2018


ABSTRACT:
Background/Objectives: Non-thermal atmospheric pressure plasma treatment has been introduced in the field of the dentistry. Especially, it has the potential to solve a boding problem of resin inlay. The aim of this study was to evaluate the effect of non-thermal atmospheric pressure plasma on resin inlay surface to examine an effect on adhesion capability. Methods/Statistical analysis: Resin-inlay (Tescera, Bisco, USA) discs (12 mm × 2 mm) were used for this study. The group with plasma treatment was treated nitrogen for 1 minute. For the surface analysis, shear bond strength (SBS), surface energy (SE), and Energy dispersive spectrometer (EDS) were evaluated. Findings: Non-thermal atmospheric pressure plasma treatment could improve bond strength with an increase of surface energy. And plasma treated group was increased oxygen (O) component. Improvements/Applications: The non-thermal atmospheric pressure plasma might be useful method in cementation of composite resin inlay.


Cite this article:
Yu-Ri Choi, Min-Kyung Kang. Effect of Non-Thermal Atmospheric Pressure Plasma on Adhesion Capability in Cementation of Composite Resin Inlay. Research J. Pharm. and Tech 2018; 11(6): 2561-2564. doi: 10.5958/0974-360X.2018.00473.0

Cite(Electronic):
Yu-Ri Choi, Min-Kyung Kang. Effect of Non-Thermal Atmospheric Pressure Plasma on Adhesion Capability in Cementation of Composite Resin Inlay. Research J. Pharm. and Tech 2018; 11(6): 2561-2564. doi: 10.5958/0974-360X.2018.00473.0   Available on: https://rjptonline.org/AbstractView.aspx?PID=2018-11-6-74


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RNI: CHHENG00387/33/1/2008-TC                     
DOI: 10.5958/0974-360X 

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